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TLGE27C Datasheet, PDF (2/8 Pages) Marktech Corporate – Toshiba TLxE27 Series LEDs
Toshiba TLxE27 Series LEDs
Electrical and Optical Characteristics (Ta=25oC)
Part
Number
PWL nm Material
λP
View
Angle
2θ1/2
Luminous Intensity
Iv
min.
typ. max. IF@
TLGE27C
574
InGaAlP
30o x 50o
85.00 250.00
− 20mA
TLOE27C
612
InGaAlP
30o x 50o
272.00 800.00
− 20mA
TLRE27C
644
InGaAlP
30o x 50o
85.00 300.00
− 20mA
TLRME27C
636
InGaAlP
30o x 50o
153.00 400.00
− 20mA
TLSE27C
623
InGaAlP
30o x 50o
272.00 750.00
− 20mA
TLYE27C
590
InGaAlP
30o x 50o
272.00 650.00
− 20mA
−
nm
−
deg
mcd
−
Forward Voltage
VF
min. typ. max. IF@
− 2.00 2.40 20mA
− 2.00 2.40 20mA
− 1.90 2.40 20mA
− 1.90 2.40 20mA
− 1.90 2.40 20mA
− 2.00 2.40 20mA
V
−
Rev Current
IR
max. VR@
50
4V
50
4V
50
4V
50
4V
50
4V
50
4V
µA
−
Precautions
• Soldering temperature: 260°C max, soldering time: 3 s max (soldering portion of lead: up to 2 mm from the body of the device).
• If the lead is formed, the lead should be formed up to 5 mm from the body of the device without forming stress to the resin. Soldering should
be performed after lead forming.
• This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by
this IR light.
NOTICE:
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can
malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when
utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in
which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
• In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent
TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for
Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc..
• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment,
office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor
warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause
loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety
devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk.
• Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut
or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
• The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA
CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is
granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others.
• The information contained herein is subject to change without notice.
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