CLN6A_15 Datasheet, PDF (11/12 Pages) Marktech Corporate – The CLN6A LED delivers superior value with common voltage, current, size

Soldering & Handling
1. Cleaning
• Don’t use unspecified chemical liquids to clean the SMD LED; the chemical could harm the SMD LED. When
washing is necessary, please immerse the SMD LED in alcohol at normal room temperature for less than 1
minute and dry at normal room temperature for 15 minutes before use.
• The influence of ultrasonic cleaning on the SMD LED depending on factors such as ultrasonic power and the way
SMD LED are mounted. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the
SMD LED.
2. Moisture-Proof Packing
• In order to prevent moisture absorption into SMD LED during the transportation and storage, SMD LED is
packed in a moisture barrier bag. Desiccants and a humidity indicator are packed together with SMD LED as the
secondary protection. The indication of humidity indicator card provides the information of humidity within SMD
packing.
3. Storage
• Shelf life in original sealed bag at storage condition of <40ºC and <90%RH is 12 months. Baking is required
whenever shelf life is expired.
• Before openning the packaging , Please check whether bag leak air or not.
• After bag opening, the SMD LED must be stored under the condition < 30ºC and < 60%RH. Under this condition,
SMD LED must be used (subject to reflow) within 168 hours after bag opening, and re-baking is required when
exceeding 168 hours.
• For baking, place SMD LED in oven at temperature 80ºC±5ºC and relative humidity <=10%RH, for 24 hours.
• Take out the material from packaging bag for re-bake. Do not open the door of oven frequently during the baking
process.
4. Soldering
• Manual soldering by soldering iron
• The use of a soldering iron of less than 25W is recommended and the temperature of the iron must be kept at
below 315ºC, with soldering time within 2 seconds.
• The epoxy resin of SMD LED should not be in contact with tip of soldering iron.
• No mechanical stress should be exerted on the resin portion of SMD LED during soldering.
• Handling of SMD LED should be done when the package has been cooled down to below 40ºC or less. This is to
prevent the SMD LED failures due to thermal-mechanical stress during handling.
• Reflow Soldering: The temperature (top surface of SMD LED) profile is as below:
Heat Sink
Melting-point
Pre-heat
Soak
Time
Solder = Lead-free
Average ramp-up rate = 4ºC/s max
Preheat temperature = 150ºC ~200ºC
Preheat time = 100s max.
Ramp-down rate = 6ºC/s max.
Reflow
Cooling
Peak temperature = 250ºC max.
Time within 5ºC of actual Peak Temperature = 10s max.
Duration above 217ºC is 80s max.
Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and
the Cree logo are registered trademarks of Cree, Inc.
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CLD-CT979.003
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: [phone]
Fax: [phone]
www.cree.com/ledlamps