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UT190-85_15 Datasheet, PDF (1/6 Pages) Marktech Corporate – Gen III LEDs | |||
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Cree® UltraThin⢠Gen III LEDs
Data Sheet
CxxxUT190-Sxxxx-30
Creeâs UltraThin LEDs combine highly efficient InGaN materials with Creeâs proprietary Gâ¢SiC® substrate to deliver
superior price/performance for blue LEDs. These vertically structured LED chips are small in size and require a low
forward voltage. Creeâs UT⢠series chips are tested for conformity to optical and electrical specifications and the
ability to withstand 1000 V ESD. Applications include keypad backlighting where sub-miniaturization and thinner
form factors are required.
FEATURES
⢠Small Chip â 190 x 190 x 85 μm
⢠UT LED Performance
â 450 & 460 nm â 14 mW min.
â 470 nm â 12 mW min.
â 527 nm â 4.0 mW min.
⢠Low Forward Voltage
â 2.9 V Typical at 5 mA
⢠Single Wire Bond Structure
⢠Class 2 ESD Rating
APPLICATIONS
⢠Mobile Phone Keypads
⢠Audio Product Display Lighting
⢠Mobile Appliance Keypads
⢠Automotive Applications
CxxxUT190-Sxxxx-30 Chip Diagram
Top View
Die Cross Section
Bottom View
Junction
160 x 160 μm
Anode (+)
85-μm Diameter
t = 85 μm
190 x 190 μm
Bottom Surface
105 x 105 μm
Cathode (-)
80 x 80 μm
Subject to change without notice.
www.cree.com
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