EZ400 Datasheet, PDF (1/5 Pages) Marktech Corporate – Gen II LED

Cree^® EZ400™ Gen II LED
Data Sheet
CxxxEZ400-Sxxx00-2
Cree’s EZBright™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN
materials with Cree’s proprietary optical design and device technology to deliver superior value for high-intensity LEDs.
The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern. Additionally, these
LEDs are die attachable with conductive epoxy, solder paste or solder preforms, as well as the flux eutectic method.
These vertically structured, low forward voltage LED chips are approximately 170 microns in height. Cree’s EZ™ chips
are tested for conformity to optical and electrical specifications. These LEDs are useful in a broad range of applications,
such as general illumination, automotive lighting and LCD backlighting.
FEATURES
• EZBright Power Chip LED Rf Performance
– 90 mW min. @ 150 mA – 450 & 460 nm
– 75 mW min. @ 150 mA - 470 nm
– 25 mW min. @ 150 mA - 527 nm
• Lambertian Radiation
• Conductive Epoxy, Solder Paste or Preforms,
or Flux Eutectic Attach
• Low Forward Voltage – 3.5 V Typical at 150 mA
• Single Wire Bond Structure
• Maximum DC Forward Current - 200 mA
● Dielectric Passivation Across Epi Surface
APPLICATIONS
• General Illumination
– Automobile
– Aircraft
– Decorative Lighting
– Task Lighting
– Outdoor Illumination
• White LEDs
• Crosswalk Signals
• Television Backlighting
CxxxEZ400-Sxxx00 Chip Diagram
Top View
EZBright LED Chip
380 x 380 μm²
Backside
Metallization
Gold Bond Pad
112 μm
Dielectric Passivation
Bottom View
t = 170 μm
Subject to change without notice.
www.cree.com
Die Cross Section
Cathode (-)
Anode (+);
3 μm AuSn
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