DA700 Datasheet, PDF (1/5 Pages) Marktech Corporate – LEDs

Direct Attach DA700™ LEDs
CxxxDA700-Sxx000
Data Sheet
Cree’s Direct Attach DA700 LEDs are the next generation of solid-state LED emitters that combine highly efficient
InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
the TV-backlighting and general-illumination markets. The DA700 LEDs are among the brightest in the lighting market
while delivering a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down
design allows for eutectic die attach, eliminating the need for wire bonds, and enables superior performance from
improved thermal management.
FEATURES
• Direct Attach LED Technology
• Rectangular LED RF Performance
– 450 & 460 nm – 430 mW min
• High Reliability -Eutectic Attach
• Low Forward Voltage (Vf) – 3.3 V Typical at 350 mA
• Maximum DC Forward Current – 750 mA
• InGaN Junction-Down Design for Improved Thermal
Management
• No Wire Bonds Required
APPLICATIONS
• General Illumination
− Aircraft
− Decorative Lighting
− Task Lighting
− Outdoor Illumination
• White LEDs
• Camera Flash
• Projection Displays
• Automotive
• Large LCD Backlighting
– Television
CxxxDA700-Sxx000 Chip Diagram
Top View
Die Cross Section
Bottom View
DA700 LED
700 x 700 μm
Anode (+)
645 x 75 μm
Gap 75 μm
Cathode (-)
645 x 495 μm
t = 335 μm
Subject to change without notice.
www.cree.com
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