DA3547_15 Datasheet, PDF (1/5 Pages) Marktech Corporate – LEDs

Direct Attach DA3547™ LEDs
CxxxDA3547-Sxxx00
Data Sheet
Cree’s Direct Attach DA3547 LEDs are the next generation of solid-state LED emitters that combine highly efficient
InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value
for the TV-backlighting and general-illumination markets. The DA3547 LEDs are among the brightest in the top-view
market while delivering a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-
down design allowsfor eutectic die attach, eliminating the need for wire bonds, and enables superior performance
from improved thermal management. The design is optimally suited for industry-standard top-view packages.
FEATURES
APPLICATIONS
• Rectangular LED RF Performance
• Large LCD Backlighting
– 450 & 460 nm – 76 mW min
– Television
• High Reliability -Eutectic Attach
• General Illumination
• Low Forward Voltage (Vf) – 3.1 V Typical at 50 mA • Medium LCD Backlighting
• Maximum DC Forward Current – 150 mA
– Portable PCs
• 1000-V ESD Threshold Rating
– Monitors
• InGaN Junction-Down Design for Improved Thermal • LED Video Displays
Management
• White LEDs
• No Wire Bonds Required
CxxxDA3547-Sxxx00 Chip Diagram
Top View
Die Cross Section
DA3547 LED
350 x 470 μm
Anode (+)
296 x 90 μm
Gap 90 μm
t = 155 μm
Cathode (-)
296 x 236 μm
Bottom View
Subject to change without notice.
www.cree.com
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