DA1000_15 Datasheet, PDF (1/5 Pages) Marktech Corporate – Direct Attach DA1000 LEDs

Direct Attach DA1000™ LEDs
CxxxDA1000-Sxx000
Data Sheet
Cree’s Direct Attach DA1000 LEDs are the next generation of solid-state LED emitters that combine highly efficient
InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
the general-illumination market. The DA1000 LEDs are among the brightest in the lighting market while delivering
a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-down design allows for
a eutectic direct die-attach process, eliminating the need for wire bonds, and enables superior performance from
improved thermal management.
FEATURES
• Direct Attach LED Technology
• Rectangular LED RF Performance
– 450 & 460 nm – 485 mW min
• High Reliability -Eutectic Attach
• Low Forward Voltage (Vf) – 3.15 V Typical at 350 mA
• Maximum DC Forward Current – 1000 mA
• InGaN Junction-Down Design for Improved Thermal
Management
• No Wire Bonds Required
APPLICATIONS
• General Illumination
− Aircraft
− Decorative Lighting
− Task Lighting
− Outdoor Illumination
• White LEDs
• Camera Flash
• Projection Displays
• Automotive
CxxxDA1000-Sxx000 Chip Diagram
Top View
Die Cross Section
DA1000 LED
1000 x 1000 μm
Anode (+)
945 x 75 μm
Gap 75 μm
Cathode (-)
945 x 795 μm
t = 335 μm
Subject to change without notice.
www.cree.com
Bottom View
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