LSSHSM-2-DV Datasheet, PDF (1/1 Pages) Major League Electronics – Low Profile Socket Strips - Vertical

Major League Electronics .079 cl Low Profile Socket Strips - Surface Mount - Vertical
Ordering Information
LSSHSM-2 XX D X XX V XXX TR P XX LF
Pins Per Row
02 - 40
Lead Free
Row Specification
D = Dual Row
Alignment Pin
Leave blank if not needed
AP = With
Low Insertion Option
Leave blank for Standard 6oz. Insertion Force
Fill with 'L' for Low 3.3oz. Insertion Force
Packing Information
Mates with:
TR-P = Tape and Reel with Plastic Pick and Place pad ^BSTC,
BSTCM,
Plating Options
30µ Gold on Contact Area / Matte Tin on Tail H
Matte Tin All Over
T
10µ Gold on Contact Area / Matte Tin on Tail GT
Specifications
Insertion Force - Single Contact only - H Plating:
4oz. (1,11N) avg with .079 (2,00mm) sq. pin
Withdrawal Force - Single Contact only - H Plating:
3oz. (0,83N) avg with .079 (2,00mm) sq. pin
Current Rating: 2.0 Ampere
Insulation Resistance: 1000MΩ Min.
Dielectric Withstanding: 500V AC
Contact Resistance: 20 mΩ Max.
Operating Temperature: -40°C to + 105°C
Max. Process Temperature:
Polarized Position
Leave blank if not needed
If required, specify empty pin position, e.g. 012 for Pin 12
Vertical
BSTCR,
BSTCRSM,
BSTS,
TBSTC,
TBSTCM,
TBSTS,
TBSTCM,
TBSTS,
TSHC,
TSHCR,
TSHCRE,
TSHCRSM,
TSHR,
TSHRE,
TSHS,
Peak: 260°C up to 20 secs.
Process: 230°C up to 60 secs.
Wave: 260°C up to 6 secs.
Reflow: 260°C up to 10 secs.
Manual Solder: 350°C up to 5 secs.
TSHSCM,
TTSHC,
TTSHCR,
TTSHCRE,
TTSHR,
Materials
Contact Material: Copper Alloy
Insulator Material: Nylon 6T
TTSHRE,
TTSHS,
TTSHSM
Plating: Au or Sn over 50µ" (1,27) Ni
Products cut to specific sizes are uncancellable/nonreturnable
Parts are subject to change without notice
LSSHSM-2-DV SERIES
Low Profile Socket Strips - Vertical
19 SEPT 08
4235 Earnings Way, New Albany, Indiana, 47150, USA
1-800-782-3486 (USA/Canada/Mexico)
Tel: [phone]
Fax: [phone]
E-mail: [e-mail]
Web: www.mlelectronics.com