MA01503D_1 Datasheet, PDF (7/7 Pages) Tyco Electronics – X-Band Limiter/Low Noise Amplifier 8.5 -12.0 GHz

X-Band 10W Limiter/ 3-stage LNA
Assembly and Bonding Diagram
RS-O-P-DS-3003 - - 7/7
MA01503D
V_GG
0.1 µF
RF_IN
IN
100 pF
V_GG
V_GG
V_GG
+
-5V
-
Optionally VDD can be connected here.
100 pF
V_DD
V_DD
V_DD
0.1 µF
RF_OUT
OUT
Recommended bonding diagram.
Support circuitry typical of MMIC characterization fixture for CW testing.
NOTE: Indicated VGG pad represents the nominal bias condition. The
device current can be increased or decreased by bonding to either VGG+
or VGG– respectively.
Assembly Instructions:
Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 °C to less than 5 minutes.
Wirebonding: Bond @ 160 °C using standard ball or thermal compression wedge bond techniques. For
DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of
shortest length, although ball bonds are also acceptable.
Biasing Note: Must apply negative bias to V_GG before applying positive bias to V_DD to prevent
damage to amplifier.
Specifications subject to change without notice.
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