408-8649 Datasheet, PDF (5/7 Pages) Tyco Electronics – This instruction sheet covers Die Packages used in PCB Singulation systems.

PCB Singulation Systems Die Packages
408-8649
6. After grinding the perforators, measure from the
face of the perforators to the face of the punch
using a depth micrometer. Record this number in
Die Repair and Sharpening Log (in the die package
documentation package) under the perforator
length. Subtract this number from the previous
entry to determine how much material has been
removed. See Figure 8.
Grinding
Wheel
Depth Micrometer
B. Die Bushings
1. Be sure the rollers are not in contact with the
grinding table. Remove the rollers if necessary.
Refer to Figure 9.
2. Place the bottom of the lower assembly (die
block) on a clean, flat grinding chuck with bushings
facing upward. Make sure there is sufficient
clearance between the grinding wheel and the
highest part of the die package before setting the
die package on the grinding table.
3. Turn on the magnet and make sure the die
package is properly held down.
4. Before sharpening, be sure to measure from the
face of the die bushings to the face of the lower
assembly (die block) using a depth micrometer.
Compare these measurements to the last
measurements listed in the Die Repair and
Sharpening Log (in the die package documentation
package). If measurements are not the same, refer
to the die package top assembly drawing for
starting measurements.
5. Sharpen by removing enough stock from the die
bushing face to provide a clean, sharp, cutting
surface (usually 0.050 mm to 0.127 mm [.002 in. to
.005 in.]). See Figure 10.
Grinding Table/Magnet
Figure 8
Liner Pin
Bushing
Side View
Grinding
Wheel
Keep Grinding Wheel Inside
Liner Pin Bushing Area
Rollers
Grinding Table/Magnet
Liner Pin
Bushing
Figure 9
Grinding
Wheel
Front of Lower
Assembly (Die Block)
Rev A
Grinding Table/Magnet
Figure 10
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