1410142-1 Datasheet, PDF (5/6 Pages) Tyco Electronics – High Speed Backplane Interconnect Solutions

TE Connectivity
High Speed Backplane Connectors
IMPACT Connectors
n Up to 25 Gb/s performance
n Density up to 32 high speed differential pairs per cm (80 DP per inch)
n 100 Ohm
n Modular system: 2, 3, 4, 5, 6 pair/ column available. 6 through 20 columns
offered in increments of 2 columns
n See back panel for representative part numbers
n Order catalog 7-1773458-1, "IMPACT Backplane Connector System"
n Website: www.te.com/products/Impact
Z-PACK TinMan 100 Ohm and 85 Ohm Connectors
n Up to 12.5 Gb/s performance
n Density up to 14 high speed differential pairs per cm (80 DP per inch);
6-16 columns available
n Modular system: 3, 4, 5, and 6 pair/column, respectively fitting 16.25mm
(.625"), 20.32 mm (0.8") and 25.4 mm (1") slot-pitch
n 85 ohm impedance version for QPCle and Intel QPI standards, and other
85 ohm system applications
n See back panel for representative part numbers
n Order catalog 1773095, "High Speed Backplane Connector"
n Website: http://www.te.com/ZPackTinMan
Z-PACK Slim UHD Connectors
n 2 versions
n CS (Common Speed) 8 Gb/s
n HS (High Speed) 12.5 Gb/s, scalable to 20 Gb/s
n Density (in a 2 DP/Column assignment): 55 lines per cm, 141 lines per inch
(in a SE assignment)
n Low profile — 12.5 mm wide
n Flexible pin assignments
n See back panel for representative part numbers
n Order catalog 1773095, "High Speed Backplane Connector"
n Website: http://www.te.com/products/zpackuhd
www.te.com/products/2Piece-High-Speed