MA4M Datasheet, PDF (4/4 Pages) Tyco Electronics – MNS Microwave Chip Capacitors

MNS Microwave Chip Capacitors
Bonding and Handling Considerations for
MNS Chip Capacitors
Handling
Normal precautions that are common to the handling of hybrid
semiconductors also apply to MNS chip capacitors. Removal of
chips from waffle packs and subsequent handling should be
done with a vacuum pencil. Pencils equipped with either metal-
lic or nonmetallic tips are acceptable.
Surface Preparation
Each MNS chip and substrate should be free of oils and other
surface contamination. Such contaminants may result in poor
solder wetting. Cleansing can be done with acetone, alcohol,
freon, TMS or other common microelectronic solvents. Bur-
nishing of MNS capacitor chips is not necessary or recom-
mended.
Solder
Soldering temperatures up to 300ºC are acceptable for a duration
not greater than 5 seconds for MNS chip capacitors. Any of the
common tin-lead-silver, lead-indium, or higher temperature gold
alloy solders are acceptable provided that the 300ºC temperature
is not exceeded. Pure tin or tin-antimony solders are not
recommended. Cleaning of residual flux is required and can be
accomplished with a fluorinated or chlorinated solvent.
MA4M Series
Conductive Epoxy
Any of the conductive epoxies that are available for semicon-
ductor die attachment are acceptable for MNS chip capacitor
attachment. Follow the manufacturer’s recommendations for
mixing and application carefully. Take care to seat the capacitor
on the substrate using a soft implement.
Lead Bonding
Ball, ultrasonic, TC or pulse bonding of the wire or ribbon leads
are all acceptable methods. Temperature for the pulse bonder
should not exceed 300ºC. Maximum pressure applied to the
MNS capacitor chips should not exceed 25 grams for any of the
methods used. Proper procedure will result in bond strength that
exceeds MIL-STD-883B Method 2011.2 for gold wire or gold
ribbon.
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Specifications subject to change without notice.
V3.00