|
2-1393774-4 Datasheet, PDF (4/5 Pages) Tyco Electronics – P1 Relay V23026 | |||
|
◁ |
P1 V23026 Relay
P1 V23026 Relay
Recommended SolderinAg XCoICnOdiMtions
SIPRoCeld/cJeEorinDmgEmCcoJne-dnSitTdioDen-sd02aS0coBcolrddeinrginIETPgeCle1Cc6oVmo0-0n,25Sdi8g3n-iSa2t0lii-ago52nn8dna6RalsFnRRRdeellaaeyyslsay
Packing
AXICOM
10A8-9X80I0C9OReMv. E
AXICOM Telecom-, Signal and RF Relays
Soldering conditions according IEC 60058-P21-5R8ealanyd V23026 (Continued)
IPC/JEDEC J-STD-020B
20 - 40 sec Full line: typical
P1 V23026 Relay Telecom-, Signal and RF Relays
P1 V23026 Relay
Recomm240e°Cnded Soldering Conditions Dotted line: process limits
Processing
PaPcackkiningg
SIPoCldR/JeecEroinDmgEm1eCc28n4o0d0Jne°°-CddCSistTioolDdne-sr0in2ag0ccBcoondridtioi2nn0gs- 4I0EsCec
Full line: typical
60D0o5tte8d-l2in-e5: p8roacenssdlimits
Soldering1c3o0n°dCitions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
110800°°CC
forced
cooling
Packing
Tube for THT version
40 relays per tube, 2000 relays per box
Tube for
40 relays
2â000 re
130 °C
240 °C
20 - 40 sec
Full line: typical
Dotted line: fporrocceedss limits
cooling
100 °C
180 °C
130 °C
100 °C
forced
cooling
Resistance to soldering heat - Re ow pro le
Vapor Phase Soldering: Temperature/Time Proï¬le
(Lead and Housing Peak Temperature)
Vapor Phase Soldering: Temperature/Time Proï¬le
(Lead and Housing Peak Temperature)
Resistance to soldering heat - Re ow pro le
Resistance to soldering heat - Reflow profile
Vapor Phase Soldering:
temperature/time profile (lead
and housing peak temperature)
Resistance to soldering heat - Re ow pro le
Vapor Phase Soldering: Temperature/Time Proï¬le
T(aLpeeaadndarneedl foHroSuMsTinvegrsPioneak Temperature)
480 relay1s1.p6±e0r.2reel, 2400 relays per box
Tape and
480 rela
2â400 pe
Reel dimension
11.6±0.2
Time (s)
Infrared Soldering: Temperature/Time Proï¬le
(Lead and Housing Peak Temperature)
Time (s)
Recommended re ow soldering pro le
Infrared Soldering: temperature/
time profile (lead and housing
RecRoecmommmeennddeeddrefrloew osowldesriongldperorfiilne g pro
peak temperature)
le
ReIenlfdraimreednsSioonldering: Tem11p.6±e0r.2ature/Time Proï¬le
(Lead and Housing Pe1a1.6k±0T.2emperature)
Reel dimensions
Time (s)
Infrared Soldering: Temperature/Time Proï¬le
R(eLeel daidmeannsdioHn ousing Peak Temperature)
Reel dimension
Recommended re ow soldering pro le
All speciï¬cations subject to change. Consult Tyco Electronics for latest speciï¬cations.
Time (s)
Time (s)
Infrared Soldering: Temperature/Time Proï¬le
(Lead and Housing Peak Temperature)
All speciï¬cations subject to change. Consult Tyco Electronics for latest speciï¬cations.
Infrared Soldering: Temperature/Time Proï¬le
(Lead and Housing Peak Temperature)
All speciï¬cations subject to change. Consult Tyco Electronics for latest speciï¬cations.
Time (s)
Infrared Soldering: Temperature/Time Proï¬le
All s(pLeeciaï¬cdatiaonnsdsuHbjeocut tsoicnhganPgee. CaoknsTuelt mTycpoeErleactturorneic)s for latest speciï¬cations.
All speciï¬cations subject to change. Consult Tyco Electronics for latest speciï¬cations.
9 of 12
All speciï¬cations subject to change. Consult Tyco Electronics for latest speciï¬cations.
4
02-2012, Rev. 0212
Datasheets and product specification
Datasheets and product data is subject to the
www.te.com
according to IEC 61810-1 and to be used
terms of the disclaimer and all chapters of
© 2011 Tyco Electronics Corporation,
only together with the âDefinitionsâ section.
the âDefinitionsâ section, available at
a TE Connectivity Ltd. company
http://relays.te.com/definitions
All speciï¬cations subject to change. Consult Tyco Electronics for latest speciï¬cations.
9 of 12
Datasheets, product data, âDefinitionsâ sec-
tion, application notes and all specifications
are subject to change.
9 of 12
|
▷ |