MA4SPS420 Datasheet, PDF (3/7 Pages) Tyco Electronics – SURMOUNT PIN Diodes

SURMOUNT^TM PIN Diodes
MA4SPS421, MA4SPS422
MA4SPS420 Series
V2
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components. Bulk
handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80 Au / 20 Sn or
Sn 60 / Pb 40 solder is recommended. Conductive silver epoxy for die attachment may also be used for lower incident
power (<1 W average incident power) applications.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to100 grams applied normal to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so that
its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit trace
near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die. The solder
joint must Not be made one at a time, creating un-equal heat flow and thermal stress. Solder reflow should Not be
performed by causing heat to flow through the top surface of the die. Since the HMIC glass is transparent, the edges
of the mounting pads closest to each other can be visually inspected through the die after attach is completed.
A typical profile for a Sn 60/ Pb 40 Soldering process is provided in Application Note, “ M538 ” , “ Surface Mounting
Instructions “ on the MA-COM website www.macom.com.
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
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