English
Language : 

V23050-A1024-A533 Datasheet, PDF (2/3 Pages) Tyco Electronics – Force Guided Relay SR6 A/B/C/V
General Purpose Relays
Force Guided Relays
Force Guided Relay SR6 A/B/C/V (Continued)
SCHRACK
Insulation Data
Initial dielectric strength
between open contacts
between contact and coil
between adjacent contacts
Clearance/creepage
between open contacts
between contact and coil
between adjacent contacts
Insulation to EN 50178, type of insulation
between contact and coil
between adjacent contacts
1500Vrms
4000Vrms
3000Vrms
microdisconnection
≥5.5/5.5mm
≥5.5/5.5mm
reinforced
reinforced
Dimensions
SR6 A/B/C
Other Data
Material compliance: EU RoHS/ELV, China RoHS, REACH, Halogen content
refer to the Product Compliance Support Center at
www.te.com/customersupport/rohssupportcenter
Ambient temperature
-25 to 70°C
Category of environmental Protection
IEC 61 810
RTIII
Weight 30g
Resistance to soldering heat THT
IEC 60068-2-20
260°C/5s
Packaging/unit
tube/10 pcs.
For more detailed information see product specification 2158003
Accessories
27E1079
SR6A and SR6B socket (1423991-1)
27E1081
SR6C socket (1423992-1)
24A243
Relay hold down clip (1423994-1)
For details see datasheet 1654787
SR6 V
PCB layout / terminal assignment
Bottom view
3 ​form A + 3 form B, 3 NO + 3 ​NC versions
SR6 A
S0367-DN
S0367-DU
4 ​form A + 2 form B, 4 NO + 2 ​NC versions
SR6 B
5 ​form A + 1 form B, 5 NO + 1 ​NC versions
SR6 C
S0368-CA
S0368-CA
S0368-CE
S0368-CC
S0368-CB
S0368-CD
4 ​form A + 2 form B, 4 NO + 2 ​NC versions
SR6 V
The design of the SR6 V allows
clearance/creepage of 5.5 ​mm
on the PCB.
2
11-2012, Rev. 1112
www.te.com
© 2012 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
S0368-CU
S0368-CV
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.