MA4SPS552 Datasheet, PDF (2/6 Pages) Tyco Electronics – Surface Mount Monolithic PIN Diode Chip

Surface Mount PIN Diode Chip
Electrical Specifications: @ +25 °C
Symbol
C_T
C_T
R_S
R_S
V_F
V_F
V_R
I_R
R_θJL
T_L
Parameter
Total
Capacitance
Total
Capacitance
Series
Resistance
Series
Resistance
Forward Voltage
Forward Voltage
Reverse Voltage
Reverse Leakage
Current
Thermal
Resistance
Minority Carrier
Lifetime
Conditions
-40 V, 1 MHz
-40 V, 1 GHz
100 mA, 100 MHz
20 mA, 100 MHz
100 mA
10 mA
-10 µA
-40 V
Steady State
(50% - 90% V)
+10 mA / -6 mA
MA4SPS552 SurMount ^TM Series
V 1.00
Units
pF
pF
Ω
Ω
V
V
V
nA
°C/W
µs
Min.
l -200 l
Typ.
0.08
0.06
1.7
2.4
1.00
0.86
l -275 l
l -10 l
30
2.5
Max.
0.14
1.25
1.00
Handling Procedures
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils.
The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk
handling should insure that abrasion and mechanical shock
are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use
of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these diodes
and are removed from the active junction locations. These
devices are well suited for solder attachment onto hard and
soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb
solder is recommended, with an equal temperature profile
across the contacts. Conductive epoxy paste for attachment
may also be used.
When soldering these devices to a hard substrate, hot gas
die bonding is preferred. We recommend utilizing a
vacuum tip and a force of 60 to 100 grams applied
normal to the top surface of the device. When soldering
to soft substrates, it is recommended to use a lead-tin
interface at the circuit board mounting pads. Position
the die so that its mounting pads are aligned with the
circuit board’s mounting pads and reflow the solder by
heating the circuit trace near the mounting pad while
applying 60 to 100 grams of force perpendicular to the
top surface of the die.
Since the HMIC™ glass is transparent, the edges of the
mounting pads closest to each other can be visually
inspected through the die after attach is completed.
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
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