MA46H146 Datasheet, PDF (2/3 Pages) Tyco Electronics – GaAs Flip-Chip Multiplier Varactor Diode

RoHs Compliant
GaAs Flip-Chip Multiplier Varactor Diode
Electrical Specifications @ T_A = +25 °C
Gamma 0.50 Abrupt Multiplier Varactors
Breakdown Voltage @ 10 μA = 26V minimum
Reverse Current @ 18 V = 50 nA maximum
Gamma = 0.45-0.55, VR = 0 to 20 V
Part Number
MA46H146
Total
Capacitance
Vr=0V
F=1MHz
(pF)
Typical
0.063
Total
Total
Capacitance Capacitance
Total
Capacitance
Vr=4V
F=1MHz
(pF)
Typical
0.040
Vr=10V
F=1MHz
(pF)
Typical
0.032
Vr=25V
F=1MHz
(pF)
Typical
0.030
Total
Capacitance
Ratio
Vr=0V
Vr=25V
-
Typical
2.1
MA46H146
V3
Q
Minimum
Vr=4V
f=50MHz
-
Typical
15600
Applications
These GaAs Flip Chip devices are suited for milli-
meter wave frequency tunable filters, where ex-
tremely low parastics are required to maintain rea-
sonable Q. In addition, this product can be used in
multiplier circuits, for 2X and 3X output frequencies
in the millimeter wave frequency bands.
Assembly Requirements using
Electrically Conductive Ag Epoxy
These chips are designed to be inserted onto hard
or soft substrates with the junction side down. They
must be mounted with Electrically Conductive Ag
epoxy. Solders are not recommended due to Tung-
sten metallization beneath the gold contacts. The
die can also be assembled with the junction side
up, and wire or ribbon bonds made from the bond
pads to the circuit trace. Circuit can be preheated
to 125 – 150 °C. Use a controlled amount of con-
ductive epoxy for each bond pad. Finished, uniform
silver epoxy thickness should be between 1 – 2
mils. Cure epoxy per manufacturer’s schedule. For
extended cure times, temperatures must be below
200 °C.
Handling Procedures
The following precautions should damaging GaAs
Flip-Chips:
Cleanliness
These chips should be handled in a clean environ-
ment. Do not attempt to clean die after installation.
Static Voltage Sensitivity
Varactor diodes are ESD sensitive and can be
damaged by static electricity. Proper ESD tech-
niques and precautions should be followed when
handling these devices.
General Handling
The protective polymer coating on the active areas
of these devices provides scratch protection, par-
ticularly for the metal Airbridge which contacts the
anode. Dice can be handled with tweezers or vac-
uum pickups and are suitable for use with auto-
matic pick-and-place equipment.
Specifications Subject to Change Without Notice.
2
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product(s) or information contained herein without notice. M/A-COM makes
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