NANOSMDC200F-2 Datasheet, PDF (18/20 Pages) Tyco Electronics – PolySwitch Resettable Devices Surface-mount Devices

Solder Reflow and Rework Recommendation for Surface-mount Devices
Classification Reflow Profiles
Profile Feature
Pb-Free Assembly
Average ramp up rate (Ts_MAX to Tp)
Preheat
3°C/second max.
• Temperature min. (Ts_MIN)
• Temperature max. (Ts_MAX)
• Time (ts_MIN to ts_MAX)
Time maintained above:
150°C
200°C
60-120 seconds
• Temperature (T_L)
• Time (t_L)
Peak/Classification temperature (Tp)
217°C
60-150 seconds
260°C
Time within 5°C of actual peak temperature
Time (tp)
30 seconds max.
Ramp down rate
3°C/second max.
Time 25°C to peak temperature
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package
body surface.
Figure S14
Tp
T
L Ts
MAX
Ts
MIN
25
Reflow Profile
tp
Ramp up
t
L
Critical Zone
T to Tp
L
ts
Preheat
Ramp down
t 25˚C to Peak
Time
Solder Reflow
• Recommended reflow methods:
- IR
- Hot air
- Nitrogen
• Recommended maximum paste thickness: 0.25mm (0.010 inch)
• Devices can be cleaned using standard methods and aqueous solvents.
• We believe the optimum conditions for forming acceptable solder fillets occur when a reasonable amount of solder paste is placed
underneath each device’s termination. As such, we request that customers comply with our recommended solder pad layouts.
• Customer should validate that the solder paste amount and reflow recommendations meet its application.
• We request that customer board layouts refrain from placing raised features (e.g. vias, nomenclature, traces, etc.) underneath PolySwitch
devices. It is possible that raised features could negatively impact solderability performance of our devices.
Rework
• femtoSMD, picoSMD, nanoSMD, microSMD and miniSMD series: standard industry practices.
Please also avoid direct contact to the device.
• SMD series: rework should be confined to removal of the installed product and replacement with a fresh device.
12
Table S7 Tape and Reel Specifications for Surface-mount Devices (in Millimeters)
Description
W
P₀
P₁
P₂
A₀
B₀
B₁ max.
D₀
F
E₁
E₂ min.
T max.
T₁ max.
K₀
Leader min.
Trailer min.
femtoSMDC
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
Table S8
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
picoSMDC
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
Table S8
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
nanoSMDC
EIA 481-1
8.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
2.0 ± 0.05
1.95 ± 0.10
Table S8
4.35
1.55 ± .05
3.50 ± 0.05
1.75 ± 0.10
6.25
0.6
0.1
Table S8
390
160
miniSMDC
midSMD
and
except
microSMD decaSMDC050F/60 miniSMDE190 decaSMDC050F/60
EIA 481-1
EIA 481-1
EIA 481-2
EIA 481-2
SMD
EIA 481-2
8.0 ± 0.30
12.0 ± 0.30
24.0 ± 0.30
16.0 ± 0.30
16.0 ± 0.30
4.0 ± 0.10
4.0 ± 0.10
4.0 ± 0.10
4.0 ± 0.10
4.0 ± 0.10
4.0 ± 0.10
8.0 ± 0.10
8.0 ± 0.10
8.0 ± 0.10
8.0 ± 0.10
2.0 ± 0.05
2.0 ± 0.05
2.0 ± 0.10
2.0 ± 0.10
2.0 ± 0.10
2.9 ± 0.10
Table S8
5.70 ± 0.10
5.11 ± 0.15
5.6 ± 0.23
3.50 ± 0.10
Table S8
11.90 ± 0.10
5.6 ± 0.23
8.1 ± 0.15
4.35
8.2
20.1
12.1
12.1
1.55 ± .05 1.5 + 0.10/ -.00 1.55 ± .05 1.5 + 0.10/ -.00 1.5 + 0.10/ -.00
3.50 ± 0.05 5.50 ± 0.05
11.50 ± 0.10
7.50 ± 0.10
7.50 ± 0.10
1.75 ± 0.10 1.75 ± 0.10
1.75 ± 0.10
1.75 ± 0.10
1.75 ± 0.10
6.25
10.25
22.25
14.25
14.25
0.6
0.6
0.6
0.6
0.6
0.1
0.1
0.1
0.1
0.1
Table S8
Table S8
0.95 ± 0.10
1.8 ± 0.15
3.2 ± 0.15
390
390
400
400
400
160
160
160
160
160
SMD2
EIA 481-2
16.0 ± 0.30
4.0 ± 0.10
12.0 ± 0.10
2.0 ± 0.10
6.9 ± 0.23
9.6 ± 0.15
12.1
1.5 + 0.10/ -.00
7.50 ± 0.10
1.75 ± 0.10
14.25
0.6
0.1
3.4 ± 0.15
400
160
132
RoHS Compliant, ELV Compliant
HF Halogen Free