BBRF550 Datasheet, PDF (18/28 Pages) Tyco Electronics – Overcurrent Protection Device

Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices
RUSBF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
Cont’d
10
RGEF
Physical Characteristics
Lead material
RGEF300 to RGEF1100 : Tin-plated copper, 0.52mm² (20AWG), ø0.81mm/0.032in.
RGEF1200 to RGEF1400 : Tin-plated copper, 0.82mm² (18AWG), ø1.0mm/0.04in.
Soldering characteristics
Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand
RGEF300 and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a;
can withstand 5 seconds at 260°C ±5°C
RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b;
can withstand 10 seconds at 260°C ±5°C
Insulating material
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature
-40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
-40°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
RHEF
Physical Characteristics
Lead material
RHEF050 to RHEF200 : Tin-plated copper clad steel, 0.205mm² (24AWG), ø0.51mm/0.020in.
RHEF300 to RHEF1100 : Tin-plated copper, 0.52mm² (20AWG), ø0.81mm/0.032in.
RHEF1300 to RHEF1500 : Tin-plated copper, 0.82mm² (18AWG), ø1.0mm/0.04in.
Soldering characteristics
Solderability per ANSI/J-STD-002 Category 3
Solder heat withstand
per IEC 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ±5°C
Insulating material
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature
-40°C~125°C
Note: Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
125°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
Storage Conditions for Radial-leaded Devices
Storage conditions
40°C max., 70% RH max.; devices should remain in original sealed bags prior to use.
Devices may not meet specificed values if these storage conditions are exceeded.
Note: For the TR devices series, see the telecommunications and networking devices section.
128
RoHS Compliant, ELV Compliant