1410200-1 Datasheet, PDF (13/26 Pages) Tyco Electronics – High Speed Backplane Connectors

High Speed Backplane Connectors
MULTIGIG RT Tier 2 Connector System
Target Applications
I High speed telecommunica-
tions equipment
I Midrange and high-end
servers
I Networking equipment
I Blindmate design
I High speed custom
platforms
I Mass data storage
I Rugged, mission-critical
applications
Product Features
I Excellent performance to
6.25+ Gb/s–
I High density: 113 contacts
per inch provides 56 contact
pairs per inch for
differential signaling
I Options include 20.32
[.800] and 25.40 [1.000]
pitch card spacing
I Modular options for signal,
power, keying and guidance
I Optimized footprints
I Robust design
I Low noise levels
I Supports differential pair
widths of 6 mils with 9 mil
spacings
I Single-ended, open pin
field and power wafers
available
The MULTIGIG RT Tier 2
connector is the latest
product release to meet
customer requirements for
high-density and high-
performance two-piece
interconnects. In TE and
independent lab tests,
the MULTIGIG RT Tier 2
connector has performed
in excess of 6 Gb/s using
standard FR-4 board mate-
rial and routing techniques,
and has been demon-
strated to 10 Gb/s.
The MULTIGIG RT Tier 2
connector system provides
the flexibility to configure
the daughtercard for
Differential, Single-ended,
Open Pin Field, or Power
within a single connector
module. All of these options
then mate into a common
Backplane Receptacle.
The robust connector uses
daughtercard plugs with a
printed circuit board (PCB)
wafer design and back-
plane receptacles with a
completely enclosed dual-
beam design. All signal
lines use redundant points
of contact for high reliability.
The MULTIGIG RT Tier 2
connector is available for
both 20.32 [.800] and 25.40
[1.000] pitch card spacing.
The totally modular system
allows flexibility in choosing
signal and power modules
as well as guidance, keying,
and electrostatic discharge
(ESD) modules to meet the
most demanding applica-
tions. Signal modules can
be customized for specific
electrical requirements —
such as sequencing — that
are critical in high speed
applications.
Power modules are available
with two- and four-voltage
options, each circuit capa-
ble of carrying 20 amps.
The robust metal guide pin
provides eight keying
options and a unique ESD
contact to discharge static
when daughtercards are
hot-plugged.
5
Availability
Fully validated SPICE models: E-mail requests to [e-mail]
Pro/E models and IGES models: E-mail requests to [e-mail]
www.te.com
IGES is a trademark of IAMBA Networks,
Inc.
PRO/E is a trademark of Parametric
Technology Corp.
Catalog 1773095
Revised 4-12
www.te.com
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
Dimensions are in millimeters
and inches unless otherwise
specified.
USA: [phone]
Canada: [phone]
Mexico/C. Am.: [phone]
Latin/S. Am.: [phone]
Germany: [phone]
149
UK: [phone]
France: [phone]
Netherlands: [phone]
China: [phone]