ZEN132V130A24LS Datasheet, PDF (1/5 Pages) Tyco Electronics – Overvoltage transient suppression

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Menlo Park, CA 94025-1164
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PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
Raychem Circuit Protection Products
PRODUCT: ZEN132V130A24LS
DOCUMENT: SCD 26665
REV LETTER: D
REV DATE: FEBRUARY 28, 2008
PAGE NO.: 1 OF 5
Specification Status: Released
GENERAL DESCRIPTION
Raychem PolyZen devices are
polymer enhanced, precision Zener
diode micro-assemblies. They offer
resettable protection against multi-
Watt fault events without the need for
multi-Watt heat sinking.
The Zener diode used for voltage
clamping in a PolyZen micro-
assembly was selected due to its relatively flat voltage vs
current response. This helps improve output voltage
clamping, even when input voltage is high and diode
currents are large.
An advanced feature of the PolyZen micro-assembly is
that the Zener diode is thermally coupled to a resistively
non-linear, polymer PTC (positive temperature
coefficient) layer. This PTC layer is fully integrated into
the device, and is electrically in series between V_IN and
the diode clamped V_OUT.
This advanced PTC layer responds to either extended
diode heating or overcurrent events by transitioning from
a low to high resistance state, also known as ”tripping”. A
tripped PTC will limit current and generate voltage drop. It
helps to protect both the Zener diode and the follow on
electronics and effectively increases the diode’s power
handling capability.
The polymer enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive
voltage spikes, voltage transients, incorrect power supplies
and reverse bias. These devices are particularly suitable
for portable electronics and other low-power DC devices
BENEFITS
• Stable Zener diode helps shield downstream
electronics from overvoltage and reverse bias
• Trip events shut out overvoltage and reverse
bias sources
• Analog nature of trip events minimizes
upstream inductive spikes
• Minimal power dissipation requirements
• Single component placement
FEATURES
• Overvoltage transient suppression
• Stable V_Z vs fault current
• Time delayed, overvoltage trip
• Time delayed, reverse bias trip
• Multi-Watt power handling capability
• Integrated device construction
• RoHS Compliant
TARGET APPLICATIONS
• DC power port protection in portable
electronics
• DC power port protection for systems using
barrel jacks for power input
• Internal overvoltage & transient suppression
• DC output voltage regulation
TYPICAL APPLICATION BLOCK DIAGRAM
Power Supply
(External or Internal)
PolyZen Protected Electronics
GND
2
V_{IN 1 PolyZen}
+
Device
V_OUT
3 Regulated
Output
R_Load
Protected downstream
electronics