ZEN132V130A24CE Datasheet, PDF (1/8 Pages) Tyco Electronics – Polymer Enhanced Zener Diode Micro-Assemblies

PolyZen
Polymer Enhanced Zener Diode
Micro-Assemblies
Over-Voltage Circuit Protection Products
PRODUCT: ZEN132V130A24CE
DOCUMENT: SCD28168
REV LETTER: A
REV DATE: JUNE 08, 2012
PAGE NO.: 1 OF 8
Specification Status: RELEASED
GENERAL DESCRIPTION
TE Circuit Protection
PolyZen devices are
polymer enhanced,
precision Zener diode
micro-assemblies.
They offer resettable
protection against
multi-Watt fault
events without the
need for multi-Watt
heat sinks.
The Zener diode used for voltage clamping in a PolyZen micro-
assembly was selected due to its relatively flat voltage vs
current response. This helps improve output voltage clamping,
even when input voltage is high and diode currents are large.
An advanced feature of the PolyZen micro-assembly is that the
Zener diode is thermally coupled to a resistively non-linear,
polymer PTC (positive temperature coefficient) layer. This PTC
layer is fully integrated into the device, and is electrically in
series between V_IN and the diode clamped V_OUT.
This advanced PTC layer responds to either extended diode
heating or overcurrent events by transitioning from a low to high
resistance state, also known as ”tripping”. A tripped PTC will
limit current and generate voltage drop. It helps to protect both
the Zener diode and the follow-on electronics and effectively
increases the diode’s power handling capability.
The polymer enhanced Zener diode helps protect sensitive
portable electronics from damage caused by inductive voltage
spikes, voltage transients, incorrect power supplies and reverse
bias. These devices are particularly suitable for portable
electronics and other low-power DC devices.
BENEFITS
 Stable Zener diode helps shield downstream
electronics from overvoltage and reverse bias
 Trip events shut out overvoltage and reverse bias
sources
 Analog nature of trip events minimizes upstream
inductive spikes
 Minimal power dissipation requirements
 Single component placement
FEATURES
 Overvoltage transient suppression
 Stable V_Z vs fault current
 Time delayed, overvoltage trip
 Time delayed, reverse bias trip
 Multi-Watt power handling capability
 Integrated device construction
 RoHS Compliant
TARGET APPLICATIONS
 DC power port protection in portable electronics
 DC power port protection for systems using
barrel jacks for power input
 Internal overvoltage & transient suppression
 DC output voltage regulation
 Tablet PCs and portable electronics
TYPICAL APPLICATION BLOCK DIAGRAM
Power Supply
(External or Internal)
PolyZen Protected Electronics
GND
2
V_{IN 1 PolyZen}
+
Device
V_OUT
3 Regulated
Output
R_Load
Protected downstream
electronics