MASW4060G Datasheet, PDF (1/3 Pages) Tyco Electronics – GaAs SP4T Switch DC - 4.0 GHz

GaAs SP4T Switch
DC - 4.0 GHz
Features
• Low Insertion Loss, 1.2 dB Typical
• Fast Switching Speed, 4 nS Typical
• Ultra Low DC Power Consumption
• Terminated Option
• RoHS* Compliant
Description
M/A/COM’s MASW4060G is an SPDT absorptive or
reflective GaAs MESFET MMIC. This part combines
small size, low insertion loss and power
consumption with high isolation. Ideal for many
applications and module use. It will function well for
designs below 4.0 GHz.
The MASW4060G is fabricated using a mature 1-
micron gate length GaAs MESFET process. The
process features full chip passivation for increased
performance and reliability.
Ordering Information
Part Number
MASW4060G
1. Die quantity varies.
Schematic
Package
DIE ¹
* Restrictions on Hazardous Substances, European Union
Directive 2002/95/EC.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
RoHS
Compliant
Pad Layout
MASW4060G
V3
Die Size - Inches (mm)
0.076 x 0.058 x 0.010 (1.920 x 1.470 x 0.25)
Absolute Maximum Rating^2,3
Parameter
Absolute Maximum
Control Value (A or B)
-8.5 Vdc
Max Input RF Power
+34 dBm
Storage Temperature
-65°C to +175°C
Max Operating Temperature
+175°C
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
3. M/A-COM does not recommend sustained operation near
these survivability limits.
Bond Pad Dimensions
Bond Pad
Dimensions - Inches
(mm)
RF
0.005 x 0.005 (0.125 x 0.125)
RF1, RF2, RF3, RF4
0.004 x 0.004 (0.100 x 0.100)
A1, A2, A3, A4
0.004 x 0.004 (0.100 x 0.100)
B1, B2, B3, B4
0.004 x 0.004 (0.100 x 0.100)
G1, G2, G3, G4 ⁴
0.008 x 0.004 (0.200 x 0.100)
T1, T2, T3, T4 ⁵
0.006 x 0.005 (0.150 x 0.125)
4. “G” pads designate internal grounds necessary to maintain
data sheet isolation. These are not DC blocked and would
need to be blocked if positive control voltage is required.
5. “T” pads denote a 50 W termination path connected to each
RFx port. If bonded to ground, it will cause the related port to
be absorbative, or matched, in the isolated condition. As
described in note 3, these pads are also not DC blocked.
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Visit www.macom.com for additional data sheets and product information.