MADP-064908-131000 Datasheet, PDF (1/9 Pages) Tyco Electronics – Surface Mount Monolithic Integrated PIN Diode Chip

Surface Mount Monolithic Integrated PIN Diode Chip:
0604 Unconnected Double Tee
MADP-064908-131000
Surmount ^TM PIN Chip V1
Features
• No Wirebonds Required
• Rugged Silicon-Glass Construction
• Silicon Nitride Passivation & Polymer Scratch
Protection
• Ultra-Low Parasitic Capacitance and Inductance
• Higher RF C.W. Power Handling
• Better Performance than Alternative Packaged
Devices
Description and Applications
This device is a Silicon-Glass PIN diode chip fabricated with
M/A-COM’s patented HMIC process. This 8.0 µm
I-region length device features 6 silicon pedestals
embedded in a low loss, low dispersion glass. The
diodes are formed on the top of a pedestal and
connections to the backside of the device are
facilitated by making the pedestal sidewalls
electrically conductive. Selective backside metallization is
applied producing a surface mount device. The
topside is fully encapsulated with silicon nitride and
has an additional polymer layer for scratch
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly. The vertical Silicon
Diode topology provides for a highly efficient heat
transfer medium.
These packageless devices are suitable for usage in
Higher ( 3 W Avg ) Incident Power Switches. Small
Parasitic Inductance and Excellent RC Constant
make the devices ideal for Absorptive SPST,
Reflective SP2T Switches, and Attenuator Circuits,
where higher P1db and Power Handling values are
required.
Dim
Inches
Millimeters
Min.
Max.
Min.
Max.
A
0.060
0.062
1.524 1.575
B
0.036
0.038
0.914 0.965
C
0.004
0.008
0.102 0.203
D
0.011
0.012
0.279 0.305
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Absolute Maximum Ratings¹
@ T_A = +25 °C (unless otherwise specified)
Parameter
Absolute Maximum
Forward Current
250 mA
Reverse Voltage
l –100 V l
Operating Temperature
-55 °C to +125 °C
Storage Temperature
-55 °C to +150 °C
Junction Temperature
+175 °C
C.W. Incident Power (dBm)
+35 dBm
Mounting Temperature
+300 °C for 10 seconds
1. Operation of this device above any one of these parameters
may cause permanent damage.
0604 Case Style - ODS-1310 (Topview)
1
6
5
2
3
4
Side View
C
DDD DD
D
2
3
4
D
D
1
6
5
Circuit Side
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
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• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macom.com for additional data sheets and product information.