MADP-042005-S Datasheet, PDF (1/4 Pages) Tyco Electronics – SURMOUNT TM 5 μm PIN Diodes

SURMOUNT ^TM 5 µm PIN Diodes—MADP-042305-130600,
MADP-042005 Series
MADP-042405-130600, MADP-042505-130600, MADP-042905-130600
V2
Features
• Surface Mount, 5 µm I-Region Length Device
• No Wirebonds Required
• Rugged Silicon-Glass Construction
• Silicon Nitride Passivation
• Polymer Scratch Protection
• Low Parasitic Capacitance and Inductance
• Higher Average and Peak Power Handling
Description and Applications
This device is a Silicon-Glass PIN diode chip fabricated
with M/A-COM’s patented HMIC^TM process. This
device features two silicon pedestals embedded in a
low loss, low dispersion glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls electrically conductive. Selective
backside metallization is applied producing a surface
mount device. This Vertical Topology provides for
Exceptional Heat Transfer. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
These packageless devices are suitable for usage in
Moderate Incident Power ( 10 W C.W. ) and 50 W , 1
uS, 0.01 Duty Cycle, Peak Power, Series, Shunt, or
Series-Shunt Switches. Smaller Parasitic
Inductance, 0.4 nH, and Excellent RC Constant,
make the devices ideal for Higher Frequency Switch
Elements compared to their Plastic Device Counterparts.
Absolute Maximum Ratings¹
@ T_A = +25 °C (unless otherwise
specified)
Parameter
Absolute Maximum
Part
042
042
042
042
305
405
505
905
Forward
Current
250 mA
Reverse
Voltage
l -80 V l
Operating
Temperature
-55 °C to +125 °C
Storage
Temperature
-55 °C to +150 °C
Junction
Temperature
+175 °C
C.W. Inci-
40
44
43
35
dent Power
(dBm)
Mounting
Temperature
+300 °C for 10 seconds
1. Operation of this device above any one of these parameters
may cause permanent damage.
Case Style
ODS-1306
A
B
Bottom Side Contacts are Circuit Side
Dim
Inches
Millimeters
Min.
Max.
Min.
Max.
A
0.040
0.042 1.025 1.075
B
0.021
0.023 0.525 0.575
C
0.004
0.008 0.102 0.203
D
0.013
0.015 0.325 0.375
E
0.011
0.013 0.275 0.325
F
0.013
0.015 0.325 0.375
G
0.019
0.021 0.475 0.525
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
C
G
D
E
F
1. Backside Metal: 0.1microns thick.
2. Shaded Areas Indicate Backside Ohmic Gold Contacts.
3. Both Devices have Same Outline Dimensions ( A to G ).
• North America Tel: [phone] / Fax: [phone]
• Europe Tel: [phone] / Fax: [phone]
• Asia/Pacific Tel: [phone] / Fax: [phone]
Visit www.macom.com for additional data sheets and product information.