XP1027-BD_15 Datasheet, PDF (8/10 Pages) M/A-COM Technology Solutions, Inc. – Power Amplifier

XP1027-BD
Power Amplifier
27 - 31 GHz
Die Outline
3.500
(0.138)
0.961 1.361 1.761
(0.038) (0.054) (0.069)
2.561 2.961 3.361
(0.101) (0.117) (0.132)
23
4
5
67
1.274
(0.050)
RF_IN
1
8
RF_OUT
2.226
(0.088)
0.0
0.0
14 13 12
11 10 9
0.961 1.361 1.761
(0.038) (0.054) (0.069)
2.561 2.961 3.361
(0.101) (0.117) (0.132)
4.000
(0.158)
NOTES:
All Dimensions shown as mm/inches.
Bond pad dimensions are shown to center of bond pad.
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Thickness is 0.110 ±0.010 (0.0046 ±0.0004).
Backside is ground. Bond pad and backside metallization are gold.
Most DC bond pads are 0.100 x 0.100 (0.004 x 0.004).
All RF and V_D3 bond pads are 0.100 x 0.200 (0.004 x 0.008)
Dicing tolerance is ±0.005 (±0.0002). Approximate weight is 8.68 mg.
Rev. V2
8
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