MA4SPS420 Datasheet, PDF (7/7 Pages) Tyco Electronics – SURMOUNT PIN Diodes

MA4SPS42X Series
SURMOUNT^TM PIN Diodes
MA4SPS421, MA4SPS422
Rev. V7
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Bonding
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,
60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but
could result in an increase in series and thermal resistance.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a
vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device. When soldering to soft
substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so
that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit
trace near the mounting pad while applying 60 to 100 grams of force perpendicular to the top surface of the die.
The solder joint must not be made one at a time, creating unequal heat flow and thermal stress. Solder reflow
should not be performed by causing heat to flow through the top surface of the die. Since the HMIC glass is
transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after
attach is completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538 , “Surface Mounting Instructions“. Application Note M541 “Bonding and Handling
Procedures for Chip Diode Devices” provides handling and assembly recommendations.
Ordering Information
The MA4SPS42X series of SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the
appropriate suffix per the table below. Tape and reel dimensions are provided in Application Note M513 located
on the M/A-COM Tech website @ www.macomtech.com.
Part Number
Gel Pack
MA4SPS421
Tape and Reel
Pocket Tape
MADP-000421-12940P
MA4SPS422
MADP-000422-12950P
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