MASW-005100-1194_2 Datasheet, PDF (6/7 Pages) M/A-COM Technology Solutions, Inc. – HMIC SP5T Silicon PIN Diode Switch

MASW-005100-1194
HMIC™ SP5T Silicon PIN Diode Switch
V3
ASSEMBLY INSTRUCTIONS
Cleanliness
The chip should be handled in a clean environment free of organic contamination.
Electro-Static Sensitivity
The MASW-005100-1194 PIN switch is ESD, Class 1A sensitive (HBM). The proper ESD handling
procedures must be used.
Wire Bonding
Thermosonic wedge bonding using 0.003” x 0.00025” ribbon or 0.001” diameter gold wire is recommended.
A stage temperature of 150°C and a force of 18 to 22 grams should be used. Ultrasonic energy, if
necessary, should be adjusted to the minimum power required to achieve a good bond. RF wire and ribbon
lengths should be kept as short as possible to minimize parasitic inductance.
Mounting
These chips have Ti-Pt-Au back metal and can be mounted using 80Au/20Sn eutectic solder or electrically
conductive Ag epoxy. Mounting surface must be flat and clean of oils and contaminants.
Eutectic Die Attachment
An 80/20 gold-tin eutectic solder preform is recommended with a work surface temperature of 255°C and
a tool tip temperature of 265°C. When hot gas is applied, the tool tip temperature should be 290°C. The
chip should not be exposed to temperatures greater than 320°C for more than 10 seconds. No more than
3 seconds should be required for the die attachment.
Silver Epoxy Die Attachment
A controlled thickness of no more than 2 mils is recommended for the best electrical and thermal
conductivity. A thin epoxy fillet should be visible around the perimeter of the chip after placement to ensure
complete coverage. Cure epoxy per manufacturer’s recommended schedule. Typically +150°C for 1 hour.
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is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.