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XP1005-BD-V2_15 Datasheet, PDF (5/9 Pages) M/A-COM Technology Solutions, Inc. – Power Amplifier
XP1005-BD
Power Amplifier
35.0-43.0 GHz
Mechanical Drawing
1.825
(0.072)
1.163
(0.046)
2
1.562
(0.062)
1.960
(0.077)
3
4
2.362
(0.093)
5
2.764
(0.109)
6
3.162
(0.125)
7
Rev. V2
0.831
(0.033)
1
8
0.478
(0.019)
0.0
0.0
14
1.163
(0.046)
13
1.562
(0.062)
12
1.960
(0.077)
11
2.362
(0.093)
10
2.764
(0.109)
9
3.162 3.526
(0.125) (0.139)
(Note: Engineering designator is 38H4PBA0157)
Units:millimeters (inches) Bond pad dimensions are shown to center of bond pad.
Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside is ground,Bond Pad/Backside Metallization:Gold
All DCBond Pads are 0.100 x 0.100 (0.004 x 0.004).All RFBond Pads are 0.100 x 0.200 (0.004 x 0.008)
Bond pad centers are approximately 0.109 (0.004) from the edge of the chip.
Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:3.987 mg.
Bond Pad #1 (RFIn)
Bond Pad #2 (Vg2)
Bond Pad #3 (Vd2)
Bond Pad #4 (Vg3A)
Bond Pad #5 (Vd3A)
Bond Pad #6 (Vg4A)
Bond Pad #7 (Vd4A)
Bond Pad #8 (RFOut)
Bond Pad #9 (Vd4B)
Bond Pad #10 (Vg4B)
Bond Pad #11 Vd3B)
Bond Pad #12 (Vg3B)
Bond Pad #13 (Vd1)
Bond Pad #14 (Vg1)
Bias Arrangement
Vg2,3
Vd2,3
2
3
4
5
6
7
Bypass Capacitors - See App Note [2]
Vg2,3 Vd2,3
RF In 1
14
13
12
11
10
Vg1
Vg4
Vd1
8 RF Out
9
Vd4
RF In
Vg1
Vd1
XP1005-BD
Vg4 Vd4
RF Out
5
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.