MSWSS-020-40 Datasheet, PDF (3/5 Pages) M/A-COM Technology Solutions, Inc. – PIN Diode Shunt Switch Element

MSWSS-020-40
PIN Diode Shunt Switch Element
Printed Circuit Board Layout
Rev. V1
Assembly
If possible, use copper filled vias underneath pin 3
for better thermals; otherwise, use vias that are
plated through, filled and plated over.
Solder mask should provide a 60 µm clearance
between copper pad and solder mask underneath
package and 125 µm clearance on outside edges of
package. Rounded package pads should have
matching rounded solder mask openings.
Use circles or squares for the thermal land stencil
such that there is only 50% to 80% solder paste
coverage.
Electrical Schematic
3
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