MADP-011028-14150T_15 Datasheet, PDF (3/9 Pages) M/A-COM Technology Solutions, Inc. – High Power PIN Diode

MADP-011028-14150T
High Power PIN Diode
50 MHz - 12 GHz
PCB Layout
Rev. V1
500 - 5000 MHz Parts List¹³
Part
C1
C2, C3
FB1
R1
L1
Value
62 pF
100 pF
470 Ω @ 1 GHz
150 Ω
82 nH
Case Style
0402
0402
0402
0402
0402
13. Max DC voltage with recommended components not to
exceed 100 V.
PCB Schematic
12. R1 is not needed when using the recommended ferrite FB1.
Assembly Recommendations
Devices may be soldered using standard
Pb60/Sn40, or RoHS compliant solders. Leads
are plated NiPdAuAg to ensure an optimum
solderable connection.
For recommended Sn/Pb and RoHS soldering
profile See Application Note M538 on the MACOM
website.
Cleanliness and Storage
These devices should be handled and stored in a
clean environment. Ends of the device are
NiPdAuAg plated for greater solderability. Exposure
to high humidity (>80%) for extended periods may
cause the surface to oxidize. Caution should be
taken when storing devices for long periods.
General Handling
Device can be handled with tweezers or vacuum
pickups and are suitable for use with automatic
pick-and-place equipment.
3
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
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