MAAA2000G Datasheet, PDF (3/3 Pages) Tyco Electronics – GaAs MMIC Voltage Variable Absorptive Attenuator DC - 12 GHz

MAAA2000G
GaAs MMIC Voltage Variable Absorptive Attenuator
DC - 12 GHz
Rev. V4
Handling Procedures
Permanent damage to the MAAA2000G may occur if the following precautions are not adhered to:
A. Cleanliness - The MAAA2000G should be handled in a clean environment. DO NOT attempt to clean
assembly after the MAAA2000G is installed.
B. Static Sensitivity - All die handling equipment and personnel should be DC grounded.
C. Transients - Avoid instrument and power supply transients while bias is connected to the MAAA2000G. Use
shielded signal and bias cables to minimize inductive pick-up.
D. Bias - Apply voltage to either control port A1/B2 or A2/B1 only when the other is grounded. Neither port
should be allowed to “float”.
E. General Handling - It is recommended that the MAAA2000G chip be handled along the long side of the die
with a sharp pair of bend tweezers. DO NOT touch the surface of the chip with fingers or tweezers.
Mounting
The MAAA2000G is back-metallized with Pd/Ni/Au (100/1,000/10,000Å) metallization. It can be die-mounted
using Au/Sn eutectic preforms or a thermally conductive epoxy. The package surface should be clean and flat
before attachment.
Eutectic Die Attach:
A. An 80/20 Au/Sn preform is recommended with a work surface temperature of approximately 255°C and a
tool temperature of 265°C. When hot 90/5 nitrogen/hydrogen gas is applied, solder temperature should be
approximately 290°C.
B. DO NOT expose the MAAA2000G to a temperature greater than 320°C for more than 20 seconds. No more
than 3 seconds of scrubbing should be required for attachment.
Epoxy Die Attach:
A. Apply a minimum amount of epoxy and place the MAAA2000G into position. A thin epoxy fillet should be
visible around the perimeter of the die.
B. Cure epoxy per manufacturer’s recommended schedule.
C. Electrically conductive epoxy is recommended but is not required.
Bonding
A. Ball or wedge bond with 1.0 mil diameter pure gold wire. Thermosonic bonding with a nominal stage
temperature of 150°C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Ultrasonic energy and time should be adjusted to the minimum levels necessary to
achieve reliable wirebonds.
B. Wirebonds should be started on the chip and terminated on the package. GND bonds should be as short as
possible; at least three and no more than four bond wires from ground pads to package are recommended.
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