MA46H146_15 Datasheet, PDF (3/4 Pages) M/A-COM Technology Solutions, Inc. – GaAs Flip-Chip Multiplier Varactor Diode

MA46H146 / MAVR-000146
GaAs Flip-Chip Multiplier Varactor Diode
0.50 Gamma Abrupt
Assembly Requirements
Using Electrically Conductive Ag Epoxy
These chips are designed to be inserted onto hard
or soft substrates with the junction side down. They
must be mounted with electrically conductive Ag
epoxy. The die can also be assembled with the
junction side up, and wire or ribbon bonds made
from the bond pads to the circuit trace. Circuit can
be preheated to 125 - 150°C. Use a controlled
amount of conductive epoxy for each bond pad.
Finished, uniform silver epoxy thickness should be
between 1 - 2 mils. Cure epoxy per manufacturer’s
schedule. For extended cure times, temperatures
must be below 200°C.
Solders are not recommended due to Tungsten
metallization beneath the gold contacts.
Rev. V5
Handling Procedures
Please observe the following precautions to avoid
damage to the GaAs flip-chips:
Cleanliness
These chips should be handled in a clean
environment. Do not attempt to clean die after
installation.
General Handling
The protective polymer coating on the active areas
of these devices provides scratch protection,
particularly for the metal airbridge which contacts
the anode. Dice can be handled with tweezers or
vacuum pickups and are suitable for use with
automatic pick-and-place equipment.
Dimensions
Dimension
A
B
C
D
E
F
Inches
Min. Max.
0.025 0.027
0.012 0.015
0.006 0.008
0.007 0.009
0.006 0.008
0.015 0.017
Millimeters
Min. Max.
0.64
0.69
0.30
0.38
0.15
0.20
0.18
0.23
0.15
0.20
0.38
0.43
Circuit Mounting Dimensions (inches)
3
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