MADS-011030-14280W Datasheet, PDF (2/3 Pages) M/A-COM Technology Solutions, Inc. – Schottky Zero Bias Detector Diode

MADS-011030-14280W
Schottky Zero Bias Detector Diode
Electrical Specifications: T_A = +25°C
Parameter
Test Conditions
Forward Voltage (V_F)
V_F @ 1 mA
Voltage Breakdown (V_B)
V_B @ 1 mA
Slope Resistance (R_D)
R_D @ 9.5 - 10.5 mA
Capacitance (C_T)
C_T @ -0.5 volts
Rev. V1
Units Min.
mV
80
V
2.5
Ohms —
pF
—
Typ.
100
3.5
6.5
0.33
Max.
130
—
10
0.45
Absolute Maximum Ratings^3,4
Parameter
Absolute Maximum
Reverse Voltage @ 25°C
2.5 Volts
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. MACOM does not recommend sustained operation near these
survivability limits.
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these HBM Class 0
devices.
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination from
perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up tools is
strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Die Attach: The die have Ti-Pt-Au back metal and gold plated contact metal. Die can be mounted with a gold-tin,
eutectic solder preform or conductive silver epoxy.
Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold tin eutectic solder perform is
recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot gas is
applied, the temperature at the tool tip should be approximately 290°C.
Eutectic Die Attachment Using Reflow Oven: See Application Note M541, “Bonding and Handling Procedures
for Chip Diode Devices”.
Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied at
approximately a 1-2 mils thickness to minimize ohmic and thermal resistances. A thin epoxy fillet should be visible
around the perimeter of the chip after placement to ensure full area coverage. Cure conductive epoxy per
manufacturer’s schedule.
Wire Bonding: 0.001” diameter gold wire is recommended with a stage temperature of 150°C and minimal force.
Ultrasonic energy should be adjusted to the minimum required. Automatic ball bonding can also be used.
2
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