MA4PBL027_15 Datasheet, PDF (2/4 Pages) M/A-COM Technology Solutions, Inc. – HMIC Silicon Beam Lead PIN Diode

MA4PBL027
HMIC Silicon Beam Lead PIN Diode
Electrical Specifications at T_A = +25°C
Parameter
Total Capacitance
Series Resistance
Test Conditions
-10 V, 1 MHz
-40 V, 1 MHz
-10 V,100 MHz
-40 V,100 MHz
10 mA / 100 MHz
20 mA, 100 MHz
10 mA, 1 GHz
Forward Voltage
20 mA
Leakage Current
-90 V
Minority Carrier Lifetime
I_F = +10 mA, I_R = 6 mA
Rev. V3
Units Min.
pF
—
Ω
—
V
0.7
µA
—
ns
—
Typ.
0.030
0.026
0.018
0.015
3.5
3.0
3.5
0.91
—
150
Max.
0.040
—
—
—
4.0
—
—
0.95
1
200
2. Total capacitance (C_T) is equivalent to the sum of Junction Capacitance (C_J) and Parasitic Capacitance (C_PAR).
3. Series resistance (R_S) is equivalent to the total diode resistance: R_S = Junction Resistance (R_J) + Ohmic Resistance (R_C).
Absolute Maximum Ratings^4,5
Parameter
Absolute Maximum
Handling Procedures
Please observe the following precautions to avoid
damage:
Forward Current
Reverse Voltage
Operating Temperature
100 mA
90 V
-55°C to +125°C
Storage Temperature
Junction Temperature
RF CW Incident Power
-55°C to +150°C
+175°C
30 dBm CW
RF & DC Dissipated Power
Mounting Temperature
150 mW
235°C for 10 sec.
4. Exceeding any one or combination of these limits may cause
permanent damage to this device.
5. MACOM does not recommend sustained operation near these
survivability limits.
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these HBM class 1
devices.
General Handling
A polymer layer provides scratch protection for the
diode junction area and anode air bridge.
However, the leads of beam lead devices are very
fragile and must be handled with extreme care. The
leads can easily be distorted or broken by the
normal pressures if not careful while handling with
tweezers. A vacuum pencil with a #27 tip is the
preferred choice for picking and placing.
Attachment
These devices were designed to be inserted onto
hard or soft substrates. Recommended methods of
attachment include thermo-compression bonding,
parallel-gap welding and electrically conductive
silver epoxy.
2
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