M02013 Datasheet, PDF (2/2 Pages) M/A-COM Technology Solutions, Inc. – 3.2 Gbps Transimpedance Amplifier with AGC

Another feature of the AGC is that it only operates on
signals greater than –17.5 dBm (@ 0.9 A/W). This knee in the
gain response is important when setting “signal detect”
functions in the following post amplifier. It also aids in active
photodiode alignment.
The AGC pad allows the AGC to be disabled during photo-
diode alignment by grounding the pad through a low imped-
ance. The AGC control voltage can be monitored during
normal operation at this pad by a high impedance (>10 MW )
circuit.
Output Stage
The signal from the TIA enters a phase splitter followed by a
DC-shift stage and a pair of voltage follower outputs. These
are designed to drive a differential (100W ) load. They are
stable for driving capacitive loads, such as interstage filters.
Each output has its own GND pad, all four GND pads on the
chip should be connected for proper operation. Since the
M02013 exhibits rapid roll-off (3 pole), simple external
filtering is sufficient.
Monitor O/P
High impedance O/P sinks replicate average photodiode
current for monitoring purposes.
PINK
2.6 V
PINA
MON
DC
Restore
Phase
Splitter
DC Shift
DOUT
DOUT
1V
AGC
Vcc
1 nf
470 pf
PINK
PINA
Rm
Monitor output
DOUTB
DOUT
M02013 Block Diagram
Recommended Circuit
Product Highlights
Applications
• ATM/SDH/SONET
• OC-48 with FEC
• L4 Modules
• 2x Fiber Channel
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General Information: [phone]
Headquarters – Newport Beach
4000 MacArthur Blvd., East Tower
Newport Beach, CA 92660-3007
02013-BRF-001-A
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Ordering Information
• M02013-A3: wafle pack (WP)
• M02013-QSPBG: quarter wafer