M02066 Datasheet, PDF (18/20 Pages) M/A-COM Technology Solutions, Inc. – 3.3 Volt Laser Driver IC for Applications to 3 Gbps Data Sheet

Packaging Specification
Figure 4-2. TQFP32 Package Information
C0.50±.05X4°5
PIN 1 ID. 0 0/±.5.005
N
1
E E1 _-A-
-B-
F1
Exposed Pad
F2
-D-
D1
D
TOP VIEW
Chamfer .203 (4X
BOTTOM VIEW
DETAIL X
DETAIL A
A2 A
b
SIDE VIEW
12° TYP.
0.17 MAX.
aaa M C
b
DETAIL A
GAGE PLANE
0.25
SEATING PLANE
01
A3
R1
-H-
R
A1 A3
0
12° TYP.
e
STAND
-C-
OFF
L
L1
DETAIL X
ccc -C-
COPLANARITY
Table 4-2. TQFP32 Package Dimensions
Dim
Tol.
5 x 5 x 1.0 mm
Dim
N
Lead count
32
e
A
Max.
1.20
b
A1
±0.05
0.05
0
A2
±0.05
1.00
01
A3
±0.05
0.4365
R
D
±0.15
7.00
R1
D1
±0.05
5.00
aaa
E
±0.15
7.00
ccc
E1
±0.05
5.00
F1
L
+0.15/-0.15
0.60
F2
L1
Ref.
1.00
Tol.
Typ.
±0.05
***
±4°
Max.
Typ.
Max.
Max.
±0.10
±0.10
02066-DSH-001-D
Mindspeed Technologies^®
Preliminary Information / Mindspeed Proprietary and Confidential
5 x 5 x 1.0 mm
0.50
0.22
0° - 7°
6°
0.15
0.15
0.08
0.08
2.67
2.67
16