M02066_17 Datasheet, PDF (16/20 Pages) M/A-COM Technology Solutions, Inc. – 3.3 Volt Laser Driver IC for Applications to 3 Gbps

4.0 Packaging Specification
4.1
Packaging Specification
Figure 4-1. Bare Die Information
CEN
ENA
DIS
GND
BIAS_MON
MOD_MON
FAIL
GND
OCA
GND
V_CC
Dimensions:
Pad opening 84 x 84 µ
Die size 1790 x 1718 µ
V_CC
OCA_SET
MOD_SET
GND
MPC_SET
TC_START
GND
TC_SLOPE
GND
C_MPC
V_CC
02066-DSH-001-D
Mindspeed Technologies^®
14
Preliminary Information / Mindspeed Proprietary and Confidential