M02068_17 Datasheet, PDF (14/18 Pages) M/A-COM Technology Solutions, Inc. – 3.3 Volt Laser Driver IC for 155/622 Mbps

4.0 Packaging Specification
4.1
Packaging Specification
Figure 4-1. Bare Die Information
1
41
ENA
DIS
GND
BIAS_MON
MOD_MON
FAIL
GND
OCA
GND
V_CC
32
31
9
10
V_CC
OCA_SET
MOD_SET
GND
MPC_SET
TC_START
GND
TC_SLOPE
GND
C_MPC
V_CC
20
21
Dimensions:
Pad opening 84 x 84 µm
Die size 1790 x 1718 µm
Die thickness 300 µm ± 10%
02068-DSH-001-C
Mindspeed Technologies^®
12
Mindspeed Proprietary and Confidential