PIN-HIPAX-SERIES_15 Datasheet, PDF (11/12 Pages) M/A-COM Technology Solutions, Inc. – High Power PIN Diodes

MA4P MELF & HIPAX^™Series
High Power PIN Diodes
V14
MELF Assembly Recommendations
♦ Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable
surfaces of MELF devices are tin plated 50 μm thick to ensure an optimum connection.
Circuit Pad Layout for MELF Diodes
Dimension
A
B
C
Package Style
1072
inches mm
0.093 2.36
0.050 1.27
0.060 1.52
Package Style
1091
inches mm
0.150
3.81
0.050
1.27
0.100
2.54
MELF Internal Construction
A
C
B
B
Ordering Information
MELF diodes are available in tape and reel in quantities as shown in table below
Package Style
Quantity (7” Reel)
Bulk Devices Per Bag
1072T
1500 or 5000
N/A
1091T
500
N/A
Tape and reel information can be found on the M/A-COM website at http://www.macomtech.com/Application Notes/pdf/M513.pdf
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is considering for development. Performance is based on target specifications, simulated results,
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and/or prototype measurements. Commitment to develop is not guaranteed.
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.