MA4P Datasheet, PDF (11/13 Pages) M/A-COM Technology Solutions, Inc. – High Power PIN Diodes

MA4P MELF & HIPAX Series
High Power PIN Diodes
V16
MELF Assembly Recommendations
Devices may be soldered using standard 60Sn/40Pb or RoHS compliant solders. Axial leads and solderable
surfaces of MELF devices are tin plated 50 μm thick to ensure an optimum connection.
For recommended Sn/Pb and RoHS soldering profiles See Application Note M538 on the MACOM website.
Circuit Pad Layout for MELF Diodes
Dimension
A
B
C
Package Style
1072
1091
inches mm inches
mm
0.093 2.36 0.150
3.81
0.050 1.27 0.050
1.27
0.060 1.52 0.100
2.54
MELF Internal Construction
A
C
B
B
Ordering Information
MELF diodes are available in tape and reel in quantities as shown in table below
Package Style
1072T
1091T
Quantity (7” Reel)
1500 or 5000
500
Tape and reel information can be found in application note M513 the MACOM website.
Bulk Devices Per Bag
N/A
N/A
11
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
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