02006-DSH-001-B Datasheet, PDF (11/17 Pages) M/A-COM Technology Solutions, Inc. – CMOS Pre-amplifier with AGC for Long-reach

Applications
4.3
Layout Considerations
Use good high-frequency design and layout techniques, taking care to bypass V_CC over the frequencies to several
hundred MHz. When using die, take care to minimise bond-wire length, especially for the PIN A and Gnd pads. A
typical TO-can assembly is shown in Figure 4-3.
Figure 4-3. Typical TO-can Assembly
D_OUT
D_OUT
470pF
Gnd
V_CC
02006-DSH-001-B
Mindspeed Technologies^®
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