MMP70XX-127 Datasheet, PDF (1/4 Pages) M/A-COM Technology Solutions, Inc. – MELF PIN Diodes

MMP70xx-127 Series
MELF PIN Diodes
Features
 Ceramic Surface Mount Package
 Low R_S <1 Ω (lower insertion loss & higher IIP3)
 Low Thermal Resistance <20°C/W for Higher
Power
 Hermetically Sealed
 RoHS* Compliant
Description
The MMP7000‐127 MELF PIN diode series is
manufactured using a proprietary diode process
which optimizes the anode and cathode bonding
area of the diode to the adjacent heat spreading
metal posts within the ceramic package.
This unique geometry provides lower electrical a
nd thermal resistance within the surface mount
package to provide higher average power
performance to comparable surface mount diode
packages.
With lower thermal resistance (<20 ºC/W), RF C.W.
incident power levels of 50 dBm and RF peak
incident power levels of 60 dBm are very achievable
in higher power UHF cold switching applications.
The low series resistance (<1 Ω), coupled
with the longer minority carrier lifetime, (>8 μs),
provides better IIP3 distortion values >70 dBm, for
SP2T TX‐RX switches.
These devices are hermetically sealed and are
constructed with materials to meet the stringent
requirements for commercial and military
applications. These devices are RoHS compliant.
Rev. V1
CS127-1 & CS127-4
Applications
These diodes are designed to be used in high
average power switch and attenuator applications,
operating from 1 MHz to 1 GHz at incident power
levels of 100 W average power and 1 KW
peak power. These devices are durable, reliable,
and are capable of meeting all military, commercial,
and industrial applications.
Ordering Information
Part Number
MMP70xx-127-1R
MMP70xx-127-4R
Package
2000 piece reel
500 piece reel
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
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