MAT10XXX Datasheet, PDF (1/3 Pages) M/A-COM Technology Solutions, Inc. – Attenuator DIE

MAT10xxx Series
Attenuator DIE
DC - 40 GHz
Features
 Medium Power Handling 2 W CW
 Flat Response from DC to 40 GHz
 Return Loss:
>18 dB DC to 12 GHz
>16 dB 13 to 40 GHz
 Space Saving Footprint:
0.030” x 0.030” (.762 x .762 mm)
 Very Good Stability Over Temperature
(TRC <100 PPM)
 Ground Wrap to Top
(No ground bonding required)
 RoHS* Compliant
Description
These fixed attenuator chips are fabricated using our
state of the art thin film metallization and advanced
photolithography technology.
All devices are available in chip form with a
metalized ground connection on the back. This
ground is wrapped around on the four corners of the
chip so additional ground bonding ribbon is not
required.
The chips may be attached using conductive epoxy
or solder preform. Gold contacts on the input and
output pads make assembly, using standard
bonding equipment, fast and reliable. Custom values
and configuration available on request.
Rev. V3
Front to back metallization in 4 places
Bonding pad sizes and resistor outline
may differ from value to value.
Electrical Specifications: T_A = +25°C
Part Number
Attenuation (dB)
MAT10010
1
MAT10020
2
MAT10030
3
MAT10040
4
MAT10050
5
Insertion Loss (dB)
+/-0.30
+/-0.30
+/-0.30
+/-0.30
+/-0.30
Return Loss (dB)
>18
>18
>18
>18
>18
CONTINUED
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
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