MASW6030G_15 Datasheet, PDF (1/5 Pages) M/A-COM Technology Solutions, Inc. – GaAs DPDT Switch DC - 6.0 GHz

MASW6030G
GaAs DPDT Switch
DC - 6.0 GHz
Rev. V3
Features
 Low Insertion Loss, 0.5 dB Typical
 Fast Switching Speed, 4 ns Typical
 Ultra Low DC Power Consumption
 RoHS* Compliant
Pad Layout
Description
MA/COM’s MASW6030G is a GaAs MMIC DPDT
switch die. The MASW6030G is ideally used where
low power consumption is required.
Typical applications include transmit / receive
switching, switch matrices and switched filter banks,
WLAN IEEE 802.11a and 802.11 b/g systems.
Other applications include cordless phones and
base stations.
Ordering Information
Part Number
MASW6030G
1. Die quantity varies.
Package
DIE ¹
Absolute Maximum Rating ^2,3
Parameter
Absolute Maximum
Control Value (A or B)
0/-8 V
Max Input RF Power
+34 dBm
(0.5 - 6.0 GHz with 0/-8 V CTL)
Storage Temperature
-65°C to +175°C
Max Operating Temperature
+175°C
2. Exceeding any one or combination of these limits may cause
permanent damage to this device.
3. M/A-COM does not recommend sustained operation near
these survivability limits.
Truth Table ^4,5
RF1 to
RF6 to
AB
RF2
RF3
RF4
RF5
1
0
On
Off
On
Off
0
1
Off
On
Off
On
4. 0 = 0 to –0.2 V, 1 = -5 V.
5. When an RF output port is ―Off‖ it is shorted to ground
through an ―On‖ shunt MESFET.
Die Size - Inches (mm)
0.048 x 0.038 x 0.010 (1.220 x 0.970 x 0.250)
Bond Pad Dimensions
Bond Pad
RF1, RF6
Dimensions - Inches (mm)
0.005 x 0.005 (0.130 x 0.150)
RF2, RF3, RF4, RF5, A, B 0.004 x 0.004 (0.100 x 0.100)
GND
0.005 x 0.013 (0.130 x 0.320)
Schematic
RF3
D
Q2
2K
GND A B GND
S
RF5
Q3
D
2K
Q3
2K
RF1
S
2K
Q2
Q4
2K
S
2K
Q7
2K
D _Q1
S
2K
S
Q4 ^D
GND A B GND
RF2
RF4
*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
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