MASW-011052 Datasheet, PDF (1/6 Pages) M/A-COM Technology Solutions, Inc. – HMIC Silicon PIN Diode SP2T Switch with Integrated Bias Network

MASW-011052
HMIC Silicon PIN Diode SP2T Switch with Integrated Bias Network
2 - 18 GHz
Rev. V2
Features
 Broad Bandwidth Specified up to 18 GHz
 Usable up to 26 GHz
 Integrated Bias Network
 Low Insertion Loss / High Isolation
 Fully Monolithic
 Glass Encapsulate Construction
 RoHS Compliant* and 260°C Reflow Compatible
Description
The MASW-011052 device is a SP2T broad band
switch with integrated bias networks utilizing
MACOM’s patented HMIC (Heterolithic Microwave
Integrated Circuit) process. This process allows the
incorporation of silicon pedestals that form series
and shunt diodes or vias by imbedding them in low
loss, low dispersion glass. By using small spacing
between elements, this combination of silicon and
glass gives HMIC devices low loss and high isolation
performance with exceptional repeatability through
low millimeter frequencies. Large bond pads
facilitate the use of low inductance ribbon bonds,
while gold backside metallization allows for manual
or automatic chip bonding via 80/20 - Au/Sn,
62/36/2 - Sn/Pb/Ag solders or electrically conductive
silver epoxy.
Ordering Information¹
Part Number
Package
MASW-011052-14220G
Die in Gel Pack
MASW-011052-14220W
Die in Waffle Pack
1. Die quantity varies.
Functional Diagram
J4
J6
J5
C
C
C
L
L
L
SW2
J2
SW1
J3
C
C
C
C
C
J1
Pin Configuration²
Pin
Function
J1
Antenna
J2
RF_IN
J3
RF_IN
J4
Bias of J2
J5
Bias of J3
J6
Bias Antenna
2. The exposed metallization on the chip bottom must be
connected to RF, DC and thermal ground.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macomtech.com for additional data sheets and product information.
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