MASW-011021_15 Datasheet, PDF (1/6 Pages) M/A-COM Technology Solutions, Inc. – SURMOUNT Silicon PIN Diode SPDT Switch

MASW-011021
SURMOUNT^TM Silicon PIN Diode SPDT Switch
6 - 14 GHz
Features
 Specified from 8 GHz to 12 GHz
 Low Insertion Loss
 High Isolation
 Low Parasitic Capacitance and Inductance
 Surface Mountable, Fully Monolithic Die
 Glass Encapsulated Construction
 20 W Pulsed Power Handling⁵
 Silicon Nitride Passivation
 Polymer Scratch Protection
 RoHS* Compliant
Rev. V3
Description
This device is a SURMOUNT™ X-Band monolithic
SPDT switch designed for high power, high
performance applications. This Surface Mount
chipscale configuration is designed with minimal
parasitics usually associated with hybrid MIC
designs incorporating beam lead and/or bondable
PIN diodes that require chip and wire assembly.
This device is fabricated using M/A-COM
Technology Solutions’ patented HMIC™ (Heterolithic
Microwave Integrated Circuit) process, US Patent
5,268,310. This process allows the incorporation of
silicon pedestals that form series and shunt diodes
and/or vias by embedding them in low loss, low
dispersion glass.
Selective backside metalization is applied producing
a surface mount device. The topside is fully
encapsulated with silicon nitride and has an
additional polymer layer for scratch and impact
protection. These protective coatings prevent
damage to the junction and the anode airbridge
during handling and assembly.
Functional Schematic
J1
J3
B2
J2
B1
Pin Configuration ¹
Pin
Function
J1
RF C
J2
RF 1
J3
RF 2
B1
Bias 1
B2
Bias 2
1. The exposed pad centered on the chip bottom must be
connected to RF and DC ground.
Ordering Information²
Part Number
MASW-011021-14010G
MASW-011021-001SMB
Package
25 piece gel pack
Sample Test Board
2. Reference Application Note M513 for reel size information.
*Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
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