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MASW-009482 Datasheet, PDF (1/7 Pages) M/A-COM Technology Solutions, Inc. – GaAs Broadband High Power SP3T Switch DC - 4.0 GHz
MASW-009482
GaAs Broadband High Power SP3T Switch
DC - 4.0 GHz
Features
• CDMA Handset Switching Applications
• Balanced (symmetrical) RF Ports
• Low Cross Modulation
• Low Insertion Loss: 0.55 dB @ 1 GHz
• High Isolation: 27 dB @ 1 GHz
• High Power: P0.1dB = 36 dBm @ 1 GHz
• 0.5 micron GaAs pHEMT Process
• Lead-Free 2 mm 12-Lead STQFN package with
0.5 mm lead pitch
• Halogen-Free “Green” Mold Compound
• RoHS* Compliant and 260°C Reflow Compatible
Description
The MASW-009482 is an industry leading GaAs
pHEMT MMIC single pole three throw (SP3T) switch
in a lead-free 2 mm 12-lead STQFN package with
0.5 mm lead pitch. The MASW-009482 is uniquely
configured to enable switching from a common
antenna port to CDMA Cellular, PCS, or AWS ports.
It is also ideal for other applications where a com-
pact, high performance, symmetrical SP3T switch
is required.
The design is symmetric and has been fully
optimized for excellent cross modulation perform-
ance in all three paths while still maintaining excel-
lent insertion loss and isolation. The symmetrical
design allows the user to assign CDMA Cellular,
PCS and AWS to ports RF1, RF2 or RF3 as
required to optimize the layout.
The MASW-009482 is fabricated using a 0.5 micron
gate length GaAs pHEMT process. The process
features full passivation for performance and
reliability.
Ordering Information1,2
Part Number
Package
MASW-009482-TR3000
3000 piece reel
MASW-009482-001SMB
Sample Board
0.05 - 4.0 GHz Tuning
1. Reference Application Note M513 for reel size information.
2. All sample boards include 5 loose parts.
Functional Schematic
Rev. V1
Pin Configuration 3
Pin No.
Function
Description
1
V3
Control 3
2
RF3
RF Port 3
3
GND
Ground
4
GND
Ground
5
RF2
RF Port 2
6
V2
Control 2
7
GND
Ground
8
RF1
RF Port 1
9
V1
Control 1
10
GND
Ground
11
RFC
RF Common
12
GND
Ground
13
GND (paddle)
Ground
3. All package ground pins (P3,4,7,10, 12) and paddle ground
are no connection (N/C) electrically to the internal die. M/A-
COM recommends connecting all ground connections to
PCB ground to ensure a good thermal path.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
• India Tel: +91.80.43537383
• China Tel: +86.21.2407.1588
Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.