MASW-009276-000DIE_V2 Datasheet, PDF (1/5 Pages) M/A-COM Technology Solutions, Inc. – Bumped GaAs SP3T Switch for WLAN

MASW-009276-000DIE
Bumped GaAs SP3T Switch for WLAN
1.0 - 4.0 GHz
Rev. V2
Features
• 802.11b/g and Bluetooth Applications
• Low Insertion Loss:
0.5 dB 2.4 GHz to 2.5 GHz band
• High Isolation: 32 dB Typical on R_X
• Low Harmonics: <-70 dBc @ 20 dBm
• Flip-chip configuration
• RoHS* Compliant
Die Bump Pad Layout (bump side up)
Description
The MASW-009276-000DIE is a bumped GaAs
pHEMT MMIC SP3T switch. Typical applications are
WLAN (802.11 b/g) and Bluetooth applications.
The MASW-009276-000DIE delivers high
isolation, low insertion loss, and high linearity at
2.4 - 2.5 GHz. This device is fabricated using a
0.5 micron gate length GaAs pHEMT process.
The process features full passivation for
performance and reliability. This die features
SnAg (2.5%) solder bumps for Wafer Level Chip
Scale Package (WLCSP) applications.
Ordering Information
Part Number
MASW-009276-000D3K
MASW-009276-001SMB
Package
Die in 3000 piece reel
Sample Board SP3T
Die Bump Pad Configuration
Name
V_C1
BT
GND
R_X
V_C3
T_X
V_C2
RFC
Description
Voltage Control 1
Blue Tooth T_X/R_X Port
Ground
2.5 GHz R_X Port
Voltage Control 3
2.5 GHz T_X Port
Voltage Control 2
Antenna Port
Absolute Maximum Ratings ^1,2
Parameter
Input Power @ 3 V Control
Input Power @ 5 V Control
Operating Voltage
Operating Temperature
Absolute Maximum
+32 dBm
+35 dBm
+8 volts
-40°C to +85°C
Storage Temperature
-65°C to +150°C
1. Exceeding any one or combination of these limits may cause
permanent damage to this device.
2. M/A-COM Technology does not recommend sustained
operation near these survivability limits.
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
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Visit www.macomtech.com for additional data sheets and product information.
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make}
Commitment to produce in volume is not guaranteed.
changes to the product(s) or information contained herein without notice.