MASW-004103-1365 Datasheet, PDF (1/8 Pages) M/A-COM Technology Solutions, Inc. – HMICTM Silicon PIN Diode SP4T Switch

MASW-004103-1365
Silicon SP4T Surface Mount HMIC PIN Diode Switch
RoHS Compliant
Rev. V5
Features
• Operates 50 MHz to 20 GHz
• Usable up to 26 GHz
• Low Insertion Loss
• High Isolation
• Low Parasitic Capacitance and Inductance
• RoHS Compliant Surmount Package
• Rugged, Fully Monolithic
• Glass Encapsulated Construction
• Up to +38 dBm C.W. Power Handling @ +25°C
• Silicon Nitride Passivation
• Polymer Scratch Protection
• Solderable
Functional Schematic
Description
The MASW-004103-1365 is a SP4T, surmount,
broadband, monolithic switch using four sets of
series and shunt connected PIN diodes. This device
is designed for use in broadband, low to moderate
signal, high performance, switch applications up to
20 GHz. It is a surface mountable switch configured
for optimized performance and offers a distinct
advantage over MMIC, beamlead and chip and wire
hybrid designs. Because the PIN diodes of the
MASW-004103-1365 are integrated into the chip
and kept within close proximity, the parasitics
typically associated with other designs that use
individual components are kept to a minimum.
To minimize the parasitics and achieve high
performance the MASW-004103-1365 is fabricated
using M/A-COM Technology Solutions’ patented
HMIC™ (Heterolithic Microwave Integrated Circuit)
process. This process allows the silicon pedestals,
which form the series and shunt diodes or vias, to be
imbeded in low loss, low dispersion glass. The
combination of low loss glass and using tight
spacing between elements results in an HMIC
device with low loss and high isolation through low
millimeter wave frequencies.
The topside is fully encapsulated with silicon nitride
and also has an additional layer of polymer for
scratch and impact protection. The protective
coating guards against damage to the junction and
the anode airbridges during handling and assembly.
On the backside of the chip gold metalized pads
have been added to produce a solderable surmount
device.
1
J3
J4
J2
J5
J1
Pin Configuration
Pin
Function
J1
RFC
J2
RF1
Ord_J3ering
Information
2
RF2
J4
RF3
J5
RF4
Ordering Information
Part Number
MASW-004103-13650G
Package
50 piece gel pack
MASW-004103-13655P
500 piece reel
MASW-004103-13650P
3000 piece reel
MASW-004103-001SMB
Sample Test Board
• North America Tel: [phone] • Europe Tel: [phone]
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
• India Tel: [phone]
• China Tel: [phone]
Visit www.macomtech.com for additional data sheets and product information.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. _{changes to the product(s) or information contained herein without notice.}